Lockheed Martin ElectroMechanical Engr Associate / 3D modeling - Orlando, FL in Orlando, Florida

Hardware electromechanical packaging design engineer will be responsible for the hardware development for military electronics and general packaging support. Activity will require cross functional coordination to complete hardware design effort to support integration efforts for the designed electronic system. General qualifications: Researches, develops, and designs component, equipment, and networks for military application. Candidate should be familiar with chassis design, cabling and PWB design. Pro-E CAD design tool or similar 3D modeling experience is required.

Basic Qualifications Bachelors degree from an accredited college in Mechanical or ElectroMechanical Engineering or a related discipline, or equivalent experience/combined education. Entry level.

Minimum GPA: 3.0

3D modeling tools (example would be Pro-E/CREO, Catia, Solidworks or similar)

Must be able to obtain a security clearance.

Desired skills Working knowledge of printed wiring board and surface mount technologies is desired.

Working knowledge of military hardware specifications is desired.

Desired design experience includes chassis, electro-mechanical assembly, electrical cable and/or network design.

As a leading technology innovation company, Lockheed Martin’s team of 113,000 people works with partners around the world to bring proven performance to our customers’ toughest challenges. Headquartered in Bethesda, Maryland, Lockheed Martin has employees based in all 50 states and more than 570 facilities that span 70 countries.

Join us at Lockheed Martin, where we’re engineering a better tomorrow.

Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, protected veteran status, or disability status.

Job Location(s): Orlando Florida